Light-emitting device having a gain region and a reflector

ABSTRACT

A light-emitting device has a first cladding layer, an active layer formed above the first cladding layer, a second cladding layer formed above the active layer, a gain region, and a reflecting part. The active layer has first and second side surfaces parallel to each other. The gain region has a first end surface disposed on the first side surface. The gain region also has a second end surface disposed inside from the second side surface and angled relative to the second side surface. The second end surface, the gain region and the first end surface are provided in a first normal direction relative to the second end surface. The reflecting part is disposed next to the second end surface.

CROSS-REFERENCE TO RELATED APPLICATION

This is a continuation application of U.S. Ser. No. 12/638,106 filedDec. 15, 2009 that claims priority to Japanese Patent Application No.2008-324291, filed on Dec. 19, 2008, all of which are incorporatedherein by reference in their entireties.

BACKGROUND

1. Technical Field

The present invention relates to a light-emitting device.

2. Related Art

High-intensity laser devices having excellent color reproducibility showgreat promise as light-emitting devices that serve as a light source forprojectors, displays, and other display devices. However, speckle noisecomponents generated when randomly reflected rays of light at the screensurface interfere with each other. In response to this problem, JapaneseLaid-open Patent Application No. 11-64789, for example, proposes amethod for reducing speckle noise by sliding the screen to vary thespeckle pattern.

However with the method disclosed in Japanese Laid-open PatentApplication No. 11-64789, there are cases in which new problems arise;i.e., the screen is limited, a motor and other components are requiredto move the screen, and the motor or the like generate noise.

It is possible to consider using a common LED (light-emitting diode) asa light-emitting device for a light source in order to reduce specklenoise. However, sufficient light output cannot be obtained using an LED.An object of the present invention is to provide a novel light-emittingdevice which has high output and can reduce speckle noise.

SUMMARY

In order to solve the above problems, a light-emitting device of thepresent invention comprises:

a first cladding layer;

an active layer formed above the first cladding layer; and

a second cladding layer formed above the active layer, wherein

the active layer has a first side surface, and a second side surfaceparallel to the first side surface;

at least a portion of the active layer constitutes a gain region;

the gain region has a first end surface disposed on the first sidesurface side and a second end surface disposed on the second sidesurface side, and extends from the first end surface to the second endsurface in the direction inclined to the normal to the first sidesurface as viewed from above;

the second end face is orthogonal to the direction in which the gainregion extends as viewed from above;

a reflecting part is disposed on the second end face; and a part of thelight generated in the gain region is reflected in the reflecting partdisposed on the second end face and is emitted from the first endsurface

In the structure above, laser oscillation of light generated in the gainregion can be suppressed or prevented in the manner described below.Therefore, speckle noise can be reduced. With the light-emitting deviceof the present invention, the light generated in the gain regionadvances while increasing gain in the gain region and can be emitted tothe exterior. Therefore, a higher output than a conventional LED can beobtained. As described above, speckle noise can be reduced, and a novel,high-output light-emitting device can be provided in accordance with thepresent invention.

In the description of the present invention, the term “above” is usedfor referring to, e.g., a specific member (hereinafter referred to as“member A”) or the like that is formed “above” another specific member(hereinafter referred as “member B”). Such cases in the description ofthe present invention include the use of the term “above” when themember A is formed directly on member B, and when the member A is formedon member B via another member.

In the light-emitting device of the present invention, the reflectingpart may be a distributed Bragg reflecting mirror.

In the light-emitting device of the present invention, the distributedBragg reflecting mirror may include a plurality of grooves disposed atpredetermined intervals.

In the light-emitting device of the present invention, the grooves arerectangular as viewed from above, and a pair of sides facing the groovesmay be parallel to the second end face.

In the light-emitting device of the present invention, the position ofthe bottom surface of the grooves is disposed below the position of thelower surface of the active layer.

In the light-emitting device of the present invention, the position ofthe bottom surface of the grooves is disposed above the position of theupper surface of the active layer.

In the light-emitting device of the present invention, the distributedBragg reflecting mirror includes a dielectric multilayer film in which ahigh-refractive index layer and a low-refractive index layer are layeredin alternating fashion in the direction in which the gain regionextends.

In the light-emitting device of the present invention, the reflectingpart is a metal mirror.

In the light-emitting device of the present invention, an antireflectionfilm is disposed on the first end surface.

In the light-emitting device of the present invention, the gain regiondoes not overlap the first end surface and the second end surface asviewed from above from the first side surface side.

In the light-emitting device of the present invention, a plurality ofgain regions is provided.

In the light-emitting device of the present invention, there may beincluded a first electrode electrically connected to the first claddinglayer; and a second electrode electrically connected to the secondcladding layer.

In the description of the present invention, the phrase “electricallyconnected” is used for referring to, e.g., a specific member(hereinafter referred to as “member C”) or the like that is“electrically connected” to another specific member (hereinafterreferred as “member D”). Such cases in the description of the presentinvention include the use of the phrase “electrically connected” whenthe members C and D are directly electrically connected and when themembers C and D are electrically connected via another member.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIG. 1 is a perspective view schematically showing the light-emittingdevice of the first embodiment.

FIG. 2 is a cross-sectional view schematically showing thelight-emitting device of the first embodiment.

FIG. 3 is a cross-sectional view schematically showing thelight-emitting device of the first embodiment.

FIG. 4 is a cross-sectional view schematically showing thelight-emitting device of the first embodiment.

FIG. 5 is a view of the first embodiment as seen from above from thefirst side surface side.

FIG. 6 is a cross-sectional view schematically showing the steps formanufacturing the light-emitting device of the first embodiment.

FIG. 7 is a cross-sectional view schematically showing a first modifiedexample of the light-emitting device of the first embodiment.

FIG. 8 is a plan view schematically showing a second modified example ofthe light-emitting device of the first embodiment.

FIG. 9 is a cross-sectional view schematically showing a second modifiedexample of the emission device of the first embodiment.

FIG. 10 is a cross-sectional view schematically showing a third modifiedexample of the light-emitting device of the first embodiment.

FIG. 11 is a plan view schematically showing a fourth modified exampleof the light-emitting device of the first embodiment.

FIG. 12 is a cross-sectional view schematically showing a fifth modifiedexample of the light-emitting device of the first embodiment.

FIG. 13 is a plan view schematically showing the light-emitting deviceof the second embodiment.

FIG. 14 is a cross-sectional view schematically showing thelight-emitting device of the second embodiment.

FIG. 15 is a cross-sectional view schematically showing the steps formanufacturing the light-emitting device of the second embodiment.

FIG. 16 is a cross-sectional view schematically showing a modifiedexample of the steps for manufacturing the light-emitting device of thesecond embodiment.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Embodiments of the invention will be described.

First Embodiment

The light-emitting device 100 of the first embodiment will be describedfirst.

FIG. 1 is a perspective view schematically showing the light-emittingdevice 100. FIG. 2 is a plan view schematically showing thelight-emitting device 100. FIG. 3 is a cross-sectional view along theline III-III of FIG. 2. FIG. 4 is a cross-sectional view along the lineIV-IV of FIG. 2. In FIG. 1, members other than the active layer 108, thereflective part 150, and the antireflective film 160 are omitted fromthe drawing for the sake of convenience. Described here is the case inwhich the light-emitting device 100 is an InGaAlP-type (red)semiconductor light-emitting device.

The light-emitting device 100 includes a first cladding layer 106, anactive layer 108, a second cladding layer 110, and a reflective part150, as shown in FIGS. 1 to 4. The light-emitting device 100 may furtherinclude, e.g., a first electrode 120, a second electrode 122, asubstrate 102, a buffer layer 104, a contact layer 112, and anantireflective film 160.

The substrate 102 may be, e.g., a first electroconductive type (e.g., ann-type) GaAs substrate or the like.

The buffer layer 104 may be formed on the substrate 102, as shown inFIG. 3, for example. The buffer layer 104 can improve the crystallinityof a layer formed above the buffer layer, for example. The buffer layer104 may be a first electroconductive type (n-type) GaAs layer, InGaPlayer, or the like having better crystallinity (e.g., low defectdensity) than the substrate 102, for example.

The first cladding layer 106 is formed on the buffer layer 104. Thefirst cladding layer 106 is composed of, e.g., a firstelectroconductive-type semiconductor. The first cladding layer 106 maybe, e.g., an n-type AlGaP layer.

The active layer 108 is formed on the first cladding layer 106. Theactive layer 108 has a multi-quantum well (MQW) structure in which threequantum well structures composed of, e.g., an InGaP well layer and anInGaAlP barrier layer are superimposed.

A part of the active layer 108 is composed of a gain region. Light maybe generated in the gain region 180 and this light may increase in gaininside the gain region 180. The active layer 108 is in the shape of,e.g., a rectangular parallelepiped (including a cube). The active layer108 has a first side surface 107 and a second side surface 109, as shownin FIGS. 1 and 2. The first side surface 107 and the second side surfaceare parallel.

The gain region 180 has a first end surface 140 of the first sidesurface 107 side, and a second end surface 142 of the second sidesurface 109 side. The first end surface 140 may be provided to the firstside surface 107. The second end surface 142 is provided in any locationin the region in which the active layer 108 is formed, as shown inFIG. 1. In other words, the gain region 180 does not reach the secondside surface 109 in the example in the drawing, and the second endsurface 142 is not provided to the second side surface 109. In thewavelength band of the light generated by the gain region 180, thereflectivity of the second end surface 142 is greater than thereflectivity of the first end surface 140. The reflectivity of thesecond end surface 142 is preferably 100% or nearly 100%. In contrast,the reflectivity of the first end surface 140 is preferably 0% or nearly0%. Low reflectivity can be obtained by disposing, e.g., theantireflective film 160 on the first end surface 140. The antireflectivefilm 160 may be provided to the entire first side surface 107, as shownin the drawing, or may be provided solely to the first end surface 140.Examples of the antireflective film 160 that may be used include asingle-layer Al₂O₃, and SiO₂ layer, a SiN layer, a Ta₂O₅ layer, or amultilayer film composed of the preceding layers. The second end surface142 can be made highly reflective by providing a later-describedreflective part 150. The second end surface 142 is disposed so as to beorthogonal to the direction A in which the gain region 180 extends, asshown in FIG. 2. The light generated in the gain region 180 can therebybe reflected with good efficiency in the reflective part 150 provided tothe second end surface 142.

The gain region 180 extends from the first end surface 140 to the secondend surface 142 in the direction inclined to the normal P to the firstside surface 107 as viewed from above (see FIG. 2). In the example inthe drawing, the gain region 180 extends in the direction A inclinedwith respect to the normal P at an angle θ. The gain region 180 extendsin the direction A inclined with respect to the normal P to the firstside surface 107, whereby laser oscillation of the light generated inthe gain region 180 can be suppressed or prevented. The direction A inwhich the gain region 180 extends may refer to the direction thatconnects the center of the second end surface 142 and the center of thefirst end surface 140 of the gain region 180 as viewed from above, forexample.

FIG. 5 is a plan view of the active layer 108 in the example of FIGS. 1to 4 as seen from the first side surface 107 side. In the gain region180, the first end surface 140 and the second end surface 142 aresuperimposed, as shown in FIG. 5. Light generated in the gain region 180can thereby be directly prevented from multiply reflecting between thefirst end surface 140 and the second end surface 142. As result, sincethe configuration can be prevented from constituting a direct resonator,the laser oscillation of light generated in the gain region 180 can bemore reliably suppressed or prevented. Therefore, the light-emittingdevice 100 can emit light that is not laser light. In this case, forexample, the displacement width x between the first end surface 140 andthe second end surface 142 can be a positive value in the gain region180, as shown in FIG. 5. The first end surface 140 and the second endsurface 142 of a single gain region 180 do not overlap. Although notdepicted in the drawing, the first end surface 140 of one gain region180 may overlap the second end surface 142 of another gain region 180.

The reflective part 150 is provided to the second end surface 142 of thegain region 180. The reflective part 150 may be a distributed Braggreflecting mirror (DBR, hereinafter referred to “DBR mirror”). Thereflective part 150 is composed of a plurality of grooves 152 disposed apredetermined intervals in the example in the drawing. The planar shapeof the grooves 152 is, e.g., rectangular. A pair of sides (the longsides in the example of FIG. 2) facing the grooves 152 is providedparallel to the second end surface 142, as shown in FIG. 2. The positionof the bottom surface of the grooves 152 is provided lower than theposition of the lower surface of the active layer 108 in the example ofFIG. 4. The interior of the grooves 152 may be a cavity or may be filledwith an insulating material. The grooves 152 may be disposed so that thewidth a is (2m_(a)−1)λ/4n_(a), and the interval b is (2m_(b)−1)λ/4n_(b).The variables m_(a) and m_(b) are natural numbers, λ is the wavelengthof light generated in the gain region 180, n_(a) is the index ofrefraction in the grooves 152, and n_(b) is the index of refraction inthe active layer 108. Accordingly, the DBR mirror can be configured bydisposing the grooves 152 having a predetermined width at predeterminedintervals. In the example of the drawing, five grooves 152 are provided,but the number of grooves is not limited. A DBR mirror having a higherrefractive index can be obtained by increasing the number of grooves152.

The second cladding layer 110 is formed on the active layer 108. Thesecond cladding layer 110 is composed of, e.g., a secondelectroconductive type (e.g., p-type) semiconductor. The second claddinglayer 110 may be, e.g., a p-type AlGaP layer.

For example, a pin diode is composed of the p-type second cladding layer110, the active layer 108 in which impurities have not been doped, andthe n-type first cladding layer 106. The first cladding layer 106 andthe second cladding layer 110 are layers with a low refractive index andin which the forbidden bandwidth is greater than the active layer 108.The active layer 108 has a function for increasing the amplitude oflight. The first cladding layer 106 and the second cladding layer 110sandwiches the active layer 108, has a function for sealing in light,and functions as an injection barrier (electrons and positive holes).

In the light-emitting device 100, electrons and positive holes recombinein the gain region 180 of the active layer 108 when a normal biasvoltage of a pin diode is applied between the first electrode 120 andthe second electrode 122. Light is emitted by this recombination.Induced emissions occur in a chain-like fashion started by the generatedlight, and the intensity of the light inside the gain region 180 isamplified. For example, a part of the light 10 generated in the gainregion 180 is reflected in the reflective part 150 provided to thesecond end surface 142, as shown in FIG. 1, and is emitted from thefirst end surface 140 as emitted light 130. The light intensity isamplified in this interval. Light generated in the gain region 180includes light directly emitted from the first end surface 140 asemitted light 130.

The contact layer 112 may be formed on the second cladding layer 110, asshown in FIG. 3, for example. A layer that makes ohmic contact with thesecond electrode 122 may be used as the contact layer 112. The contactlayer 112 is composed of, e.g., a second electroconductive-typesemiconductor. For example, a p-type GaAs layer may be used as thecontact layer 112.

The first electrode 120 is formed over the entire lower surface of thesubstrate 102, as shown in FIG. 3, for example. The first electrode 120may be in contact with the layer (the substrate 102 in the example ofthe drawing) that is in ohmic contact with the first electrode 120. Thefirst electrode 120 is electrically connected to the first claddinglayer 106 via the substrate 102 and the buffer layer 104. The firstelectrode 120 is one electrode for driving the light-emitting device100. For example, the first electrode 120 may be one in which a Crlayer, a AuGe layer, a Ni layer, and a Au layer are layered in sequencefrom the substrate 102 side. A second contact layer (not shown) isdisposed between the first cladding layer 106 and the buffer layer 104,the second contact layer is exposed by the dry etching or the like, andthe first electrode 120 may be disposed on the second contact layer.Therefore, a single-side electrode structure can be obtained. Thisarrangement is particularly effective in the case that the substrate 102is insulative. An example of the insulative substrate 102 is asemi-insulating GaAs substrate. For example, an n-type GaAs layer or thelike may be used as the second contact layer. Although not shown, thesubstrate 102 and a member disposed thereon can be cut away using, e.g.,epitaxial lift off (ELO), laser lift off, or the like. In other words,the light-emitting device 100 can be used without having the substrate102. In this case, the first electrode 120 can be formed directly belowthe buffer layer 104, for example. This arrangement is also particularlyeffective in the case that the substrate 102 is insulative.

The second electrode 122 is formed on the contact layer 112. The secondelectrode 122 is electrically connected to the second cladding layer 110via the contact layer 112. The second electrode 122 is another electrodefor driving the light-emitting device 100. For example, the secondelectrode 122 may be one in which a Cr layer, a AuZn layer, and a Aulayer are layered in sequence from the contact layer 112 side. The lowersurface of the second electrode 122 has a flat shape in the same manneras the gain region 180, as shown in FIG. 2. In the example of thedrawing, the flat surface shape of the contact surface between thesecond electrode 122 and the contact layer 112 may determine theelectric current pathway between the electrodes 120, 122, and as aresult, may determine the flat surface shape of the gain region 180.Although not shown, the contact surface between the first electrode 120and the substrate 102 may have, e.g., the same flat surface shape as thegain region 180.

The light-emitting device 100 of the present embodiment can be appliedas a light source for, e.g., a projector, a display, an illuminationdevice, and a measuring device. This also applies to the embodimentsdescribed below.

The light-emitting device 100 has the following features, for example.

With the light-emitting device 100 of the present embodiment, laseroscillation of light generated in the gain region 180 can be suppressedor prevented as described above. Therefore, speckle noise can bereduced. Furthermore, with the light-emitting device 100 of the presentinvention, the light generated in the gain region 180 advances whileincreasing gain in the gain region 180 and can be emitted to theexterior. Therefore, a higher output than a conventional LED can beobtained. As described above, speckle noise can be reduced, and a novel,high-output light-emitting device can be provided in accordance with thepresent invention.

Generally, a light-emitting device that emits light that is not laserlight has an absorbing part disposed on the other end surface facing theend surface acting as the emission part of the gain region in order tosuppress or prevent laser oscillation. With the light-emitting device100 of the present embodiment, laser oscillation can be suppressed orprevented without the use of an adsorbing part as described above.Therefore, in accordance with the light-emitting device 100 of thepresent embodiment, a reflective part 150 may be provided to the secondend surface 142 because an absorbing part is not required.

With the light-emitting device 100 of the present embodiment, a part ofthe light 10 generated in the gain region 180 can be reflected at thereflective part 150 and advance while again increasing in gain in thegain region 180. Therefore, in accordance with the light-emitting device100 of the present embodiment, high-light output can be obtained becausethe distance for amplifying the light intensity is increased incomparison with the case in which the light is not reflected at thereflective part 150, for example.

With the light-emitting device 100 of the present embodiment, thereflective part 150 may be a DBR mirror composed of a plurality ofgrooves 152. Therefore, in accordance with the light-emitting device100, the device can be made smaller than the case in which thereflective part is disposed outside the light-emitting device 100, andthe loss of light between the gain region 180 and the reflective part150 can be suppressed.

1.2. Next, the method for manufacturing the light-emitting device 100 ofthe first embodiment will be described with reference to the drawings.

FIG. 6 is a cross-sectional view schematically showing the steps formanufacturing a light-emitting device 100, and corresponds to thecross-sectional view of FIG. 3.

(1) First, the buffer layer 104, the first cladding layer 106, theactive layer 108, the second cladding layer 110, and the contact layer112 are epitaxially grown on the substrate 102, as shown in FIG. 6, forexample. Examples of the epitaxial growing method that may be usedinclude metalorganic chemical vapor deposition (MOCVD), and molecularbeam epitaxy (MBE).

(2) Next, the grooves 152 constituting the reflective part 150 areformed in the second end surface 142, as shown in FIG. 4. The grooves152 are formed by patterning using a photolithographic technique and anetching technique.

(3) Next, the antireflective film 160 can be formed on the first endsurface 140, as shown in FIGS. 1 and 2, for example. The antireflectivefilm 160 is formed by, e.g., chemical vapor deposition (CVD),sputtering, ion-assisted deposition, or the like.

(4) Next, the second electrode 122 is formed on the contact layer 112,as shown in FIG. 3, for example. The second electrode 122 is obtained byforming an electroconductive layer on the entire surface by, e.g.,vacuum deposition, and then patterning the electroconductive layer usinga photolithographic technique and an etching technique. The secondelectrode 122 may be formed in a desired shape using a combination of,e.g., vapor deposition, lift-off, and the like. The grooves 152 may becovered with, e.g., a mask layer (not shown) so as to prevent the entryof electrode material.

Next, the first electrode 120 is formed under the lower surface of thesubstrate 102, as shown in FIG. 3, for example. The method formanufacturing the first electrode 120 is the same as the example indrawings for the method for manufacturing the second electrode 122described above. The sequence for forming the first electrode 120 andthe second electrode 122 is not particularly limited.

(5) The light-emitting device 100 of the present embodiment is obtainedby following the steps described above, as shown in FIGS. 1 to 4.

1.3. A modified example of the light-emitting device of the presentembodiment is described next. A description of the points that aredifferent from the example of the light-emitting device 100 shown inFIGS. 1 to 4 described above will be provided and a description of thepoints that are the same will be omitted.

(1) The first modified example will be described first.

FIG. 7 is a cross-sectional view schematically showing a light-emittingdevice 200 of the present modified example. The cross-sectional view inFIG. 7 corresponds to FIG. 4.

In the example of the light-emitting device 100, the case in which theposition of the bottom surface of the grooves 152 is disposed below theposition of the lower surface of the active layer 108, as shown in FIG.4. In contrast, in the present modified example, the position of thebottom surface of the grooves 152 may be disposed above the position ofthe upper surface of the active layer 108, as shown in FIG. 7, forexample. In accordance with the present modified example, the reflectivepart 150 may be a DBR mirror having the grooves 152 in the same manneras the example of the light-emitting device 100.

(2) A second modified example will be described next.

FIG. 8 is a plan view schematically showing a light-emitting device 300of the present modified example. FIG. 9 is a cross-sectional view alongthe line IX-IX.

In the example of the light-emitting device 100, a case was described inwhich the reflective part 150 is a DBR mirror composed of a plurality ofgrooves 152. In contrast, in the present modified example, thereflective part 150 may be a DBR mirror composed of a dielectricmultilayer film 352 in which a high-refractive index layer 352H and alow-refractive index layer 352L are layered in alternating fashion inthe direction A in which the gain region 180 extends. Examples that maybe used as the high-refractive index layer 352H include a SiN layer, aTa₂O₅ layer, a TiO₂ layer, and a ZrO₂ layer. Examples that may be usedas the low-refractive index layer 352L include a SiO₂ layer and a MgF₂layer. The high-refractive index layer 352H and the low-refractive indexlayer 352L may be used as a pair, and in the example of the drawing,four pairs are used, but the number of pairs is not particularlylimited. The thickness of the high-refractive index layer 352H may beset to (2m_(H)−1)λ/4n_(H). The thickness of the low-refractive indexlayer 352L may be set to (2m_(L)−1)λ/4n_(L). The variables m_(H) andm_(L) are natural numbers, λ is the wavelength of light generated in thegain region 180, n_(H) is the index of refraction of the high-refractiveindex layer 352H, and n_(L) is the index of refraction of thelow-refractive index layer 352L.

In accordance with the present modified example, the reflective part 150may be a DBR mirror composed of a dielectric multilayer film 352.

The method for manufacturing the light-emitting device 300 will bedescribed.

First, the buffer layer 104, the first cladding layer 106, the activelayer 108, the second cladding layer 110, and the contact layer 112 areepitaxially grown in the listed sequence on the substrate 102 in thesame manner as the case of the light-emitting device 100.

Next, the region along the direction A in which the gain region 180extends is etched from the second end surface 142 to the second sidesurface 109 so as to expose the region that will form at least thesecond end surface 142 as seen from the second side surface 109, asshown in FIG. 8. In the example of FIG. 9, the depth of the etching isthe lower surface of the first cladding layer 106, but may be a depththat reaches at least the upper surface of the first cladding layer 106.The etching may be carried out by, e.g., dry etching.

Next, the dielectric multilayer film 352 is formed, as shown in FIG. 9,and may be formed by layering the low-refractive index layer 352L andthe high-refractive index layer 352H in an alternating fashion from thesecond side surface 109 side. The film may be formed by fixing thesubstrate 102 in place in an orientation that allows the layering to becarried out in a uniform fashion in relation to the second end surface142. The film may be formed by, e.g. chemical vapor deposition (CVD) andsputtering.

Other steps may be carried out in the same manner as used for thelight-emitting device 100, and a specific description is thereforeomitted.

The light-emitting device 300 of the present modified example isobtained using the steps described above.

(3) A third modified example will be described next.

FIG. 10 is a cross-sectional view schematically showing thelight-emitting device 400 of the present modified example. Thecross-sectional view shown in FIG. 10 corresponds to FIG. 4.

In the example of light-emitting device 100, a case was described inwhich the reflective part 150 is a DBR mirror composed of a plurality ofgrooves 152. In contrast, in the present modified example, thereflective part 150 may be a metal mirror. The metal mirror may becomposed of a metal thin film 452 provided to the second end surface142. The metal thin film 452 is disposed so as to cover at least thesecond end surface 142. Examples of the material of the metal thin film452 include aluminum, silver, and gold.

The metal thin film 452 is formed by sputtering, for example. The methodfor manufacturing the light-emitting device 300 of the present modifiedexample may be the same method for manufacturing the light-emittingdevices 100, 200. Therefore, a detailed description is omitted.

(4) A fourth modified will be described next.

FIG. 11 is a plan view schematically showing a light-emitting device 500of the present modified example. The plan view shown in FIG. 11corresponds to FIG. 2.

In the example of the light-emitting device 100, a case of a single gainregion 180 was described. In contrast, in the present modified example,a plurality of gain regions 180 (five in the example of FIG. 11) may beprovided. The reflective part 150 may be provided to each second endsurface 142 of the plurality of gain regions 180. In the example of thedrawing, the reflective part 150 is a DBR mirror composed of the grooves152, but the reflective part 150 may be a metal mirror composed of ametal thin film 452 and a DBR mirror composed of the dielectricmultilayer film 352 of the modified example described above. Thedirection A in which the gain regions 180 extend may be the samedirection (the example of the drawing) for each gain region 180 or maybe different directions.

In accordance with the present modified example, the overalllight-emitting device can achieve a higher output than the example ofthe light-emitting device 100.

(5) A fifth modified example will be described next.

FIG. 12 is a plan view schematically showing a light-emitting device 600of the present modified example. The cross-sectional view shown in FIG.12 corresponds to the cross-sectional view shown in FIG. 3 in theexample of the light-emitting device 100.

In the example of the light-emitting device 100, the case was describedin which the upper and lower surfaces of the second electrode 122 havethe same flat surface shape as the gain region 180, as shown in FIGS. 2and 3. In contrast, in the present modified example, the upper surfaceof the second electrode 122 may be formed in a flat surface shape thatis different from the gain region 180, as shown in FIG. 12. In thepresent modified example, an insulating layer 602 having an opening isformed on the contact layer 112 and the second electrode 122 forembedding the opening may be formed. The second electrode 122 is formedinside the opening and on the insulating layer (including the opening)602. In the present modified example, the lower surface of the secondelectrode 122 has the same flat surface shape as the gain region 180,and the upper surface of the second electrode 122 is the entire surfaceon the insulating layer 602.

Examples of the insulating layer 602 that may be used include a SiNlayer, a SiO₂ layer, and a polyimide layer. The insulating layer 602 isformed by, e.g., CVD, coating, or the like.

In accordance with the present modified example, a light-emitting device600 can be provided having excellent heat dissipation because the volumeof the second electrode 122 is increased in comparison with the exampleof the light-emitting device 100.

(6) A sixth modified example will be described next.

In the example of the light-emitting device 100, the case in whichInGaAlP is used was described, but in the present modified example, itis possible to use any material that can form a light-emitting gainregion. Examples of the electroconductive material that can be usedinclude AlGaN, InGaN, GaAs, InGaAs, GaInNAs, and ZnCdSe. In the presentmodified example, a GaN substrate or the like may be used as thesubstrate 102, for example. In the present modified example, an organicmaterial or the like may be used.

(7) The modified examples described above are examples and no limitationis imposed thereby. For example, the modified example can be used insuitably combinations. These modified examples may be applied to theembodiment described below as required.

2. Second Embodiment

2.1. Next, the light-emitting device 700 of the second embodiment willbe described next, but no limitation is imposed by the followingexample.

FIG. 13 is a plan view schematically showing the light-emitting device700, and FIG. 14 is a cross-sectional view along the line XIV-XIV. Inthe light-emitting device 700 of the second embodiment, the samereference numerals are used for members having the same function as theconstituent elements of the light-emitting device 100 of the firstembodiment described above, and a detailed described thereof is omitted.

The light-emitting device 700 has a first cladding layer 106, an activelayer 108, a second cladding layer 110, insulating parts 702, and areflective part 150, as shown in FIGS. 13 and 14. The light-emittingdevice 700 may further include, e.g., a first electrode 120, a secondelectrode 122, a substrate 102, a buffer layer 104, a contact layer 112,and an antireflective film 160.

In the example of FIG. 13, the contact layer 112 may be formed in aregion (excluding the grooves 152) of the second side surface 109 sideaway from the second end surface 142. The contact layer 112 may have thesame flat surface shape as the gain region 180 in the region in whichthe second electrode 122 is formed. For example, the portion (the upperpart of the contact layer 112) of the surface of the second electrode122 in contact with at least the contact layer 112 may constitute acolumnar semiconductor deposit (hereinbelow referred to as “columnarpart”) 710, as shown in FIG. 14. The first cladding layer 106, theactive layer 108, the second cladding layer 110, and the contact layer112 may constitute the columnar part 710, for example. The secondcladding layer 110 and the contact layer 112 may also constituted thecolumnar part 710, as shown in FIG. 14.

The insulating parts 702 are laterally disposed in relation to thecolumnar part 710, as shown in FIG. 14. The insulating parts 702 areformed on a layer (second cladding layer 110 in the example of thedrawing) that is in contact with the side opposite from the secondelectrode 122 side of the columnar part 710. The insulating parts 702are in contact with the side surface of the columnar part 710, as shownin FIG. 14. The electric current between the electrodes 120, 122 canflow through the columnar part 710 sandwiched by the insulating parts702 while avoiding the insulating parts 702. For example, the flatsurface shape of the columnar part 710 determines the electric currentpathway between the electrodes 120, 122, and as a result, determines theflat surface shape of the gain region 180. Although not shown, thecolumnar part 710 and the insulating parts 702 may also be formed on thesubstrate 102 side. Examples of the insulating parts 702 that may beused include a SiN layer, a SiO₂ layer, and a polyimide layer. Theinsulating parts 702 may be formed in at least peripheral regions of thecolumnar part 710 as viewed from above. In the example of FIG. 13, theinsulating parts 702 may be provided in the same region as the secondelectrode 122 excluding the region of the columnar part 710.

The insulating parts 702 may cover at least the side surface (surfacesexcluding the first end surface 140 and the second end surface 142 ofthe gain region 180) of the active layer 108, for example. Theinsulating parts 702 may cover side surfaces other than the first endsurface 140 and the second end surface 142 among the side surfaces ofthe columnar part 710. The insulating parts 702 may have a lowerrefractive index than the refractive index of the active layer 108.Light can thereby be efficiently sealed inside the active layer 108.

The second electrode 122 is formed, e.g., over the entire surface of thecolumnar part 710 and insulating parts 702, as shown in FIGS. 13 and 14.Therefore, a light-emitting device 700 can be provided having excellentheat dissipation because the volume of the second electrode 122 isincreased in comparison with the example of the light-emitting device100 described above.

In accordance with the present invention, speckle noise can be reduced,and a novel, high-output light-emitting device can be provided in thesame manner as the light-emitting device described above.

2.2. An example of the method for manufacturing the light-emittingdevice 700 of the second embodiment will be described next withreference to the drawings. However, no limitation is imposed by thefollowing example. A description of the points that are different fromthe example of the method for manufacturing the light-emitting device100 of the first embodiment will be provided and a description of thepoints that are the same will be omitted.

FIG. 15 is a cross-sectional view schematically showing the steps formanufacturing the light-emitting device 700 and corresponds to thecross-sectional view shown in FIG. 14.

(1) First, a buffer layer 104, a first cladding layer 106, an activelayer 108, a second cladding layer 110, and a contact layer 112 areformed on the substrate 102.

(2) Next, the second cladding layer 110 and the contact layer 112 arepatterned, as shown in FIG. 15. The patterning is carried out using,e.g., a photolithographic technique and an etching technique. A columnarpart 710 can be formed in the present step.

(3) Next, grooves 152 are formed, as shown in FIG. 13, for example. Thegrooves 152 may be formed using, e.g., a photolithographic technique andan etching technique.

(4) Next, the insulating parts 702 are formed so as to cover the sidesurface of the columnar part 710, as shown in FIG. 14. Specifically, aninsulating layer (not shown) is first formed above the second claddinglayer 110 (including the top of the contact layer 112) by, e.g., CVD orcoating. The upper surface of the contact layer 112 is then exposed byetching, for example. The insulating parts 702 can be obtained byfollowing the steps described above. The grooves 152 may be embedded ornot embedded in the step for forming the insulating layer. For example,the insulating layer can be prevented from being embedded in the grooves152 by applying a resist or another mask (not shown) to the region ofthe grooves 152.

(5) Next, the first electrode 120 and the second electrode 122 areformed. The second electrode 122 may be formed on the columnar part 710and the insulating parts 702, as shown in FIG. 13. Therefore, micropatterning is not required and the risk of a broken line in the secondelectrode 122 can be reduced.

(6) The light-emitting device 700 of the present embodiment can beobtained by following the steps described above, as shown in FIGS. 13and 14.

2.3. A modified example of the light-emitting device of the presentembodiment will be described next. A description of the points that aredifferent from the example of the light-emitting device 700 shown inFIGS. 13 to 14 described above will be provided and a description of thepoints that are the same will be omitted.

FIG. 16 is a cross-sectional view schematically showing the steps formanufacturing the light-emitting device of the present modified example.The cross-sectional view shown in FIG. 16 corresponds to thecross-sectional view shown in FIG. 14 of the example of thelight-emitting device 700.

In the example of the light-emitting device 700, a case was described inwhich a columnar part 710 is formed in the manner shown in FIG. 15, theinsulating layer (not shown) is subsequently formed, and the contactlayer 112 is then exposed to thereby form the insulating parts 702. Incontrast, in the present modified example, a photoresist or another masklayer 804 is first disposed on the contact layer 112 and covers theregion above the gain region 180, as shown in FIG. 16. Next, protons orother ions 806, for example, are injected to depth that reaches, e.g.,the second cladding layer 110 using the mask layer 804. The insulatingparts 702 of the present modified example can be formed by following thesteps described above.

Modified examples are not limited to the examples described above. Themodified examples and the example of the light-emitting device 700 maybe applied to the embodiments described above as required.

3. Embodiments of the present invention were described in detail above,but those skilled in the art readily understand that it is possible tomake many modifications that do not essentially depart from the novelpoints and effects of the present invention. Therefore, all suchmodified examples are considered to be included in the scope of thepresent invention.

1. A light-emitting device comprising: a first cladding layer; an activelayer formed above the first cladding layer; a second cladding layerformed above the active layer; a gain region, which generates light byapplying a voltage, provided at a portion of the active layer; and areflecting part reflecting the light generated in the pain region,wherein the active layer has a first side surface and a second sidesurface that are parallel to each other, the gain region has a first endsurface disposed on the first side surface, and the gain region has asecond end surface disposed inside from the second side surface side andangled relative to the first side surface, the second end surface, thegain region and the first end surface are provided in a first normaldirection relative to the second end surface, and the reflecting part isdisposed next to the second end face.
 2. The light-emitting deviceaccording to claim 1, wherein the reflecting part is a distributed Braggreflecting mirror.
 3. The light-emitting device according to claim 1,wherein the reflecting part includes a plurality of grooves disposed atpredetermined intervals.
 4. The light-emitting device according to claim3, wherein the plurality of grooves are rectangular, and a pair of sidesfacing the plurality of grooves is parallel to the second end surface.5. The light-emitting device according to claim 3, wherein a bottomsurface of the plurality of grooves is disposed below a lower surface ofthe active layer.
 6. The light-emitting device according to claim 3,wherein a bottom surface of the plurality of grooves is disposed abovean upper surface of the active layer.
 7. The light-emitting deviceaccording to claim 1, wherein the reflecting part includes a dielectricmultilayer film in which a high-refractive index layer and alow-refractive index layer are layered in alternating fashion in thefirst normal direction.
 8. The light-emitting device according to claim1, wherein the reflecting part is a metal mirror.
 9. The light-emittingdevice according to claim 1, further comprising a low-reflectivity filmdisposed on the first end surface.
 10. The light-emitting deviceaccording to claim 9, wherein the low-reflectivity film is anantireflection film.
 11. The light-emitting device according to claim 1,wherein the first end surface and the second end surface is notoverlapped each other in a second normal direction relative to the firstside surface.
 12. The light-emitting device according to claim 1,wherein the gain region is in a stripe shape.
 13. The light-emittingdevice according to claim 1, wherein a plurality of gain regions areprovided.
 14. The light-emitting device according to claim 1, furthercomprises: a first electrode electrically connected to the firstcladding layer; and a second electrode electrically connected to thesecond cladding layer, wherein the voltage is applied to the gain regionthrough the first and second electrodes.